Advanced Packaging Top Die Module Engineer – Hoomie
Esterno
Advanced Packaging Top Die Module Engineer
Intel Corporation
New MexicoPanorama Heights24 settembre 2026Esterno · via Adzuna
Dettagli annuncio
Elettronica
$184,315 – $184,315 USD
Job Details: Job Description: The Role and Impact We are seeking a Module Engineer to play a pivotal role in advancing Intel's high-volume manufacturing capabilities. In this position, you will oversee critical equipment and processes that enable the production of cutting-edge integrated circuits, driving innovation in device miniaturization and semiconductor excellence. Your expertise will directly impact production efficiency, quality, and yield, ensuring Intel maintains its leadership in the…
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